Specially developed Pb free flux
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Pb free and resin flux cored
solder
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QOOS`
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Specially developed Pb free flux
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| When soldering with Pb free (SnAg and SnCu)
resin flux cored solder, the alloy melting point is 30 - 45 C higher than
with conventional solders, and the fluidity characteristics during melting
are not as good. As a result, the solder is generally harder to work. 2004A
significantly improves the workability Pb free solder and substantially
reduces bridging problems. A working temperature of 360 - 380 is recommended.
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| Properties |
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A
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@2004A
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Standard
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JIS Z 3283/A grade
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Alloy composition
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FLF01-05A07
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Flux content mass (%)
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3
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1.0-3.5
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Dryness
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Passed
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Powder talc easily removed
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Halide content (%)
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0.2
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0.1-0.5
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Copper plate corrosion test/copper mirror reaction test
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Passed
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Minimal corrosion
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Resistivity of water extract (Ωm)
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560
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500+
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Insulation resistance (Ω)
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Conditions A
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2~1011or more
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1~1010or more
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Conditions B
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6~109or more
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1~108or more
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Electromigration (DC voltage)
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Passed
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No arborescent products
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Spread factor (%)
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80or more
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@
| Workability test - flow solder test |
| Test conditions Temperature at tip of soldering iron = 380 C, spread rate = 7 mm/sec Solder wire diameter = 0.8 mm, supply rate = 20 mm/line Test pattern = 2.54 mm pitch through hole, 7 pin/line Criteria: total defects per 30 lines of flow soldering |
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| Test results Better than conventional solder; significant reduction in unfinished solder and bridging. |
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