Matsuo Handa Co.,Ltd.

Lead-free solder paste - RMA type

AM2030

Improved wettability and reliability flux

Better than conventional solder paste because:

•	Newly developed activator ensures N2 reflow and good wettability in normal atmospheric conditions
•	Reduced heat drips and anti-oxidant powder prevent formation of solder balls
•	RMA type means minimal moisture absorption by flux, thus reducing corrosion and improving resistance for better reliability
•	Light colored flux leaves unobtrusive residue
•	Minimal flux deterioration; no affect on viscosity

　特性値

		AＭ２０３０	Specifications
			JIS Z3284/Z3197
Alloy composition (FLF01)		Sn-3.0Ａｇ-0.5Cu	――――
Flux content mass (%)		10.5-11.5	1.0～3.0
Viscosity		140-200Pa・S	PCU-2total (10rpm　3min. value)
Powder particle size		25-38μm	22～45μm
Dryness		Passed	Talc powder can be easily removed by brushing
Halide content (%)		0.1	0.1±0.01
Copper plate corrosion test		Passed	Minimal corrosion
Resistivity of water extract (Ωm)		Passed	1000or more
Insulation resistance (Ω) *1	A	2×10¹¹or more	1×10¹⁰or more
	B	2×10⁹or more	1×10⁸or more
Electromigration		Passed	No arborescent products
Spread factor (%)		80-85	80 or more (copper plate)

*1 Insulation resistance test conditions

Conditions A: Temperature = 40° C , humidity = 90%, 168 hours (measured in tank)

Conditions B: Temperature = 85° C, humidity = 85%, 168 hours (measured in tank)

　Reliability test - long-term migration

•	Test conditions Temperature = 85°C, humidity = 85% Applied voltage = 50 V (DC), measured voltage = 100 V (DC) Substrate JIS Comb Pattern II, measured after applying DC 100 V for one minute
•	Test results No migration during the test; high reliability demonstrated.

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Please feel free to contact us if you have any questions.