FC63-BZ(L)Leaded solder paste

Standard type Reducing solder balls, enabling stable printing.
Also contributing to reduction in waste solder paste.

Significant reduction in solder balls.

Our unique flux technology enables the reduction of solder balls by controlling slump (solder outflow beneath components or off the land) during pre-heating.

  • FC63-BZ(L)
  • Equivalent products from other manufacturers.

Excellent printing stability

Using an activation agent with substantial stability at room temperatures ensures stable rolling performance in long hours of printing operation, contributing to reduction in wasted solder paste.

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