AZ Lead Free Solder Paste

Optimized for solderabilityPerforming with excellent heat resistance and solderability.
Effective in reducing defects like unmelted BGA.

Excellent heat resistance and solderability.

Performing with excellent heat resistance and outstanding solderability by expanding solder paste activation temperature range based on our unique activation agent technology.

  • FLF01-AZ
  • Equivalent products from other manufacturers.

Excellent storage stability.

Made with extremely stable active ingredients, excellent in stencil life and storage life at room temperatures.

Please feel free to contact us for general enquiries or questions and concerns related to products.
Page Top