BZ(L) Lead Free Solder Paste

Standard type Solder balls reduced to absolute minimum.

Significant reduction in solder balls.

Our unique flux technology enables the reduction in solder balls by controlling slump (solder outflow beneath components or off the land) during pre-heating.

Compatible with various types of base materials with good wettability.

Our unique activation agent technology provides high solderability and adhesion not just to copper base materials, but also to nickel with its durable oxide film, and brass containing zinc that is hard to spread or absorb.

Reflow profile conditions

High temperature long pre-heat profile (200℃ 2min)

Please feel free to contact us for general enquiries or questions and concerns related to products.
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